OSU Owen Cleanroom

Campus-shared photolithography facilities and thin-film deposition systems (including direct write laser lithography and focussed ion beam lithography) are used to create new devices. View an overview of the Oregon State University Owen Cleanroom click here

Highlighted Shared Instrument

OSU’s Heidleberg 66FS direct write lithography tool has been installed for nearly 2 years.
The tool has been a great success and already has 22 users.
Users include, Inpria an ONAMI Gap Company.
Inpria is commercializing inorganic printed and spin-on materials for high-performance, low-cost printed electronics

OSU users come from 7 disciplines and 10 research groups:

Physics

Chemistry

Electrical Engineering

Mechanical Industrial and Manufacturing Engineering

Chemical Engineering

Wood Science

Material Science

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For more information about how to access the Heidleberg 66FS and other tools in the OSU cleanroom contact:


Chris Tasker .(JavaScript must be enabled to view this email address)  541-737-2976

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Direct Write Lithography System Capabilities

The DWL exposes patterns in photoresist for microfabrication of electronic, photonic and micromechanical devices.
The figure below shows the mask writing process performed on the DWL and subsequent photolithography process.

imageThe DWL 66FS is configured to support the following specifications:

    0.6 micron resolution
    Substrates up to 200 mm
    Lithographic masks or direct write on substrates
    Alignment of patterns
    Back-side alignment for MEMS
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