OSU Owen Cleanroom

Campus-shared photolithography facilities and thin-film deposition systems (including direct write laser lithography and focussed ion beam lithography) are used to create new devices. See an overview of the Oregon State University Owen Cleanroom.

OSU’s Heidleberg 66FS direct write lithography tool has been installed for nearly 2 years. The tool has been a great success, with more than 22 users.

External users include, Inpria, an ONAMI Gap Company, that is commercializing inorganic printed and spin-on materials for high-performance, low-cost printed electronics

OSU users come from 7 disciplines and 10 research groups:

  • Physics
  • Chemistry
  • Electrical Engineering
  • Mechanical, Industrial, and Manufacturing Engineering
  • Chemical Engineering
  • Wood Science
  • Material Science


Learn about the Business Oregon-ONAMI Facility Matching Grant Program for First-time Users.

For more information about how to access the Heidleberg 66FS and other tools in the Own Cleanroom, contact:

  • Chris Tasker
  • .(JavaScript must be enabled to view this email address)
  • 541-737-2976

Direct Write Lithography exposes patterns in photoresist for microfabrication of electronic, photonic and micromechanical devices.
The figure below shows the mask writing process performed on the DWL and subsequent photolithography process.


The DWL 66FS is configured to support the following specifications:

  • 0.6 micron resolution
  • Substrates up to 200 mm
  • Lithographic masks or direct write on substrates
  • Alignment of patternsBack-side alignment for MEMS
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