- Economic Impact
- Nano Network
Click on the map thumbnail at right to download a PDF of the UO campus for help in locating CAMCOR and the parking options on campus. The parking structure marked #99 on the map has been recommended as the most convenient for Mixer attendees.
Campus-shared photolithography facilities and thin-film deposition systems (including direct write laser lithography and focussed ion beam lithography) are used to create new devices. See an overview of the Oregon State University Owen Cleanroom.
OSU’s Heidleberg 66FS direct write lithography tool has been installed for nearly 2 years. The tool has been a great success, with more than 22 users.
External users include, Inpria, an ONAMI Gap Company, that is commercializing inorganic printed and spin-on materials for high-performance, low-cost printed electronics
OSU users come from 7 disciplines and 10 research groups:
The OSU Electron Microscopy and Imaging Facility provides service to the research community of both life sciences and materials science related studies. The facility, located in Cordley Hall, was established in the Department of Botany and Plant Pathology in 1967 and has been in continuous operation.
In addition to supporting faculty and students, the facility welcomes external academic and government institutions and industry.
The facility maintains and operates the following instruments:
All microscopes are equipped with X-ray Energy Dispersive Spectrometers (EDS) to conduct chemical analysis.
OSEM is located at the Linus Pauling Science Center, 145 Linus Pauling Science Center, 2900 SW Campus Way-Oregon State University, Corvallis, OR 97331
Visit Oregon State’s EM and Imaging Facility website.
CEMN at Portland State University (PSU) provides researchers with state-of-the-art facilities for the characterization of nanoscale materials and devices. SEM, TEM and FIB instruments and training expertise to are available to the industry and university communities.
The facility also includes nanofabrication equipment including carbon nanotube and semiconductor nanowire deposition reactors, plasma etching , and lithography tools. A semiconductor analyzer and probe station are available for testing specimen electrical properties.
Visit CEMN’s webpage.
ONAMI’s signature research facilities are first class materials characterization and fabrication laboratories open to outside users:
They collaborate with small and large companies to develop nano and microtechnology solutions. The facilities, on a pay for service basis, enable those that do not have equipment or need extra bandwidth, access to high cost capital equipment and technical expertise. They fulfill time critical needs during production ramp and intense phases of research and development.
Users include biotech, semiconductor, solar, wood products, defense and advanced materials companies, universities and consultants.
The Microproducts Breakthrough Institute (MBI) is a Microtechnology Systems fabrication facility located on the Hewlett Packard campus in Corvallis, Oregon. The facility is a powerful collaboration between Oregon State University (OSU) and Pacific Northwest National Laboratory (PNNL) where everything from basic research to product commercialization is supported. The MBI is open to outside users and interaction with industry is encouraged. The MBI collaborates with small and large companies to develop nano and microtechnology solutions, from efficient jet engines to a portable dialysis appliance.
Visit MBI’s website.
CAMCOR is a full-service, comprehensive materials characterization center at the University of Oregon open to outside clients. CAMCOR houses capital-intensive equipment for microanalysis, surface analysis, electron microscopy, semiconductor device fabrication, as well as traditional chemical characterization. The staff members who run the facilities are expertly trained and highly experienced in sample preparation, data collection and data analysis. Visit CAMCOR’s website
For more information about how to access the Heidleberg 66FS and other tools in the Own Cleanroom, contact:
Direct Write Lithography exposes patterns in photoresist for microfabrication of electronic, photonic and micromechanical devices.
The figure below shows the mask writing process performed on the DWL and subsequent photolithography process.
The DWL 66FS is configured to support the following specifications:
For more information contact:
For information about starting a project at CAMCOR or for a facility tour, contact:
Faces of CAMCOR
Polymer characterization and research is a growing discipline at the University of Oregon. The Polymer Characterization Laboratory is equipped to characterize materials with regard to their thermal properties and, for polymeric materials, their molecular weight (distribution) and size (in solution).
Above: Atomic Force Microscopy 3D image of the surface of a nanocomposite showing well dispersed PbS nanoparticles.