Capabilities-at-a-Glance

Not sure which facility will serve your needs?

View our 'Capabilities-at-a-Glance' to get a snapshot of our materials characterization and fabrication capabilities.

Fabrication Instrument CAMCOR CEMN MBI OSCR
Lithography Direct Write Lithography      
CAMCOR-Electron Beam Lithography      
CEMN-Electron Beam Lithography      
Thin film deposition Lesker Thin Film evaporation – electron beam, DC and RF sputtering      
Metal Bonding Diffusion bonding      
Brazing      
Adhesive bonding and furnace cure      
Metal Patterning CNC micromilling      
Micro electric discharge machining (EDM)      
Wire EDM and PCM (via outside partners)      
Polymer bonding Laser welding      
Plasma bonding      
Polymer patterning CNC micromilling      
Hot embossing      
Laser machining      
Injection molding      
Casting      
Surface treatments Sputter tool      
Atomic layer deposition (ALD) tool      
Metrology Laser Scanning Conforcal microscope      
High speed camera      
Metallography sample preparation  
Characterization Instrument CAMCOR CEMN OSUEM MBI
Scanning electron Microscopes (SEM) CAMCOR: Field Emission Scanning Electron Microscopy (FESEM)      
CAMCOR: Environmental Scanning Electron Microscopy (ESEM) with EDS and EBSD
CEMN: Variable pressure, field emission SEM with EDS and EBSD
OSUEM: ESEM, field emission SEM with EDS
 
Field Emission SEM with EDS      
Phenom Desktop SEM      
DualBeam (FIB/SEM) CAMCOR: Helios 600 Dual Beam - Focused Ion Beam
CENM: FEI Strata DB-237 Dual Beam Focused Ion Beam
OSUEM: FEI Quanta 3D Dual Beam Focused Ion Beam
 
Electron Probe Microanalyzer (EPMA) Electron Probe Microanalyzer (EPMA)      
Transmission Electron Microscopy Field emission- Titan with Image corrector, EDS, EELS      
Field emission- Titan with ChemiSTEM, 4-embedded Bruker SDD detectors, EELS, HAADF, Cryo      
Field Emission- Tecnai with EDS, EELS, cryo      
LaB6- Tecnai Spirit with Cryo      
100CX with heating holder      
Cryo-plunger Vitrobot Mark IV      
Ion Mill 691 PIPS      
Surface Analysis Time-of-Flight Secondary Mass Spetrometer (ToF-SIMS)      
X-ray Photoelectron Spectrometer (XPS)      
Scanning Auger Microscope (SAM)      
MALDI/ESI Mass Spectrometer      
Scanning Near-Field Optical Microscope (SNOM)      
Atomic Force Microscope (AFM)      
X-ray Diffraction (XRD) Single-Crystal      
Powder      
Thin Film      
Nuclear Magnetic Resonance Spectroscopy 600MHz 4-Channel, 500MHz 3-Channel, 300MHz      
Electronic Spin Resonance Spectrometer (X-Band)      
Polymer Chemistry Differential Scanning Calorimeter (DSC)      
Dynamic Mechanical Analyzer (DMA)      
Thermal Gravimetric Analyzer (TGA)      
Instron-Universal materials testing      
Dimatix Precision Inkjet Materials Printer      

 

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