ESI Model 5330 laser micromachining system
Facility: MBI

355nm, 5W, 40kHz throughcut laser capable of 30um kerf through metal up to 125um thick and polymers up to 250um thick. 18"x24" maximum substrate size.

Function
laser cutting
laser drilling
laser micromachining

Technique
laser cutting
laser drilling
laser micromachining

Contact MBI

Name: Email: Phone: Reason: Note: Functions: laser cutting laser drilling laser micromachining Techniques: laser cutting laser drilling laser micromachining