ESI Model 4410 laser micromachining system
Facility: MBI

266nm, 0.25W or 532nm, 5W throughcut laser capable of 30um kerf, 200um metal thicknesses (532nm laser) and burrless polymer throughcutting (266nm laser). 3"x3" maximum substrate size.

Function
laser cutting
laser drilling
laser micromachining

Technique
laser cutting
laser drilling
laser micromachining

Contact MBI

Name: Email: Phone: Reason: Note: Functions: laser cutting laser drilling laser micromachining Techniques: laser cutting laser drilling laser micromachining